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Cal-Aurum
  • Home
  • Manufacturing Process
  • Plating Types
    • Gold
    • Silver
    • Palladium Nickel
    • Tin
    • Albaloy
    • Electroless Nickel
    • Copper
    • Nickel
  • Cal-Aurum
  • Quality / Accreditations
  • About Us
  • Contact






plating type


palladium nickel plating


Palladium-Nickel (PdNi) alloy deposits provide not only an alternative to gold plating on connectors and circuit boards, but can also serve as a performance enhancement when used in combination with gold. When Palladium-Nickel is used as an underplate to the gold plating, a thinner gold “Flash” may be used while maintaining the same level electrical conductivity, and at the same time, improving the overall wear resistance.


specifications

ASTM B867 Electrodeposited Coatings of Palladium-Nickel for Engineering Use



CLASS


Deposit thickness may be specified in micrometers (μ m) ranging from Class 0.4 to Class 3.0.

Most common range is Class is 0.5 (approx. 20μ ” minimum) to Class 1.3 (approx. 51μ ”)


type i


*75% Pd / 25% Ni


type ii


80% Pd / 20% Ni


type iii


*85% Pd / 15% Ni


type iv


*90% Pd / 10% Ni

*Note: Cal-Aurum Industries currently offers only Type II PdNi, which ranges from 75-85% Pd.

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