plating type
palladium nickel plating
Palladium-Nickel (PdNi) alloy deposits provide not only an alternative to gold plating on connectors and circuit boards, but can also serve as a performance enhancement when used in combination with gold. When Palladium-Nickel is used as an underplate to the gold plating, a thinner gold “Flash” may be used while maintaining the same level electrical conductivity, and at the same time, improving the overall wear resistance.
specifications
ASTM B867 Electrodeposited Coatings of Palladium-Nickel for Engineering Use
CLASS
Deposit thickness may be specified in micrometers (μ m) ranging from Class 0.4 to Class 3.0.
Most common range is Class is 0.5 (approx. 20μ ” minimum) to Class 1.3 (approx. 51μ ”)
type i
*75% Pd / 25% Ni
type ii
80% Pd / 20% Ni
type iii
*85% Pd / 15% Ni
type iv
*90% Pd / 10% Ni
*Note: Cal-Aurum Industries currently offers only Type II PdNi, which ranges from 75-85% Pd.