plating type
copper plating
Copper plating can be used as an undercoat deposit for nickel and other metals, and can serve as a barrier layer to prevent both corrosion and base metal migration to the surface. Other applications for copper plating include use as a heat treatment stop-off shield, carburizing or decarburizing shield, or for use as a maskant. Copper deposits range from a matte/dull appearance to a very bright/shiny finish. Depending on the application, copper may be deposited using one of several unique processes including Bright, to eliminate buffing; High Speed, for electroforming; or Fine Grained, to prevent case hardening.
specifications
MIL-C-14550 Copper Plating, Electrodeposited (This spec has been cancelled, but is still in wide use.)
Thickness Classes:
0 0.00100-0.00500 inch thick
1 0.00100 inch thick
2 0.00050 inch thick
3 0.00020 inch thick
4 0.00010 inch thick
specifications
ASTM B 734 Standard Specification for Electrodeposited Copper for Engineering Uses
thickness classes:
25 25μ" minimum
20 20μ" minimum
12 12μ" minimum
5 5μ" minimum
x Thickness specified
specifications
AMS 2418 Plating, Copper
type i
Engineering
type ii
For Masking