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Cal-Aurum
  • Home
  • Manufacturing Process
  • Plating Types
    • Gold
    • Silver
    • Palladium Nickel
    • Tin
    • Albaloy
    • Electroless Nickel
    • Copper
    • Nickel
  • Cal-Aurum
  • Quality / Accreditations
  • About Us
  • Contact






plating type


copper plating


Copper plating can be used as an undercoat deposit for nickel and other metals, and can serve as a barrier layer to prevent both corrosion and base metal migration to the surface. Other applications for copper plating include use as a heat treatment stop-off shield, carburizing or decarburizing shield, or for use as a maskant. Copper deposits range from a matte/dull appearance to a very bright/shiny finish. Depending on the application, copper may be deposited using one of several unique processes including Bright, to eliminate buffing; High Speed, for electroforming; or Fine Grained, to prevent case hardening.


specifications

MIL-C-14550 Copper Plating, Electrodeposited (This spec has been cancelled, but is still in wide use.)


Thickness Classes:


0 0.00100-0.00500 inch thick

1 0.00100 inch thick

2 0.00050 inch thick

3 0.00020 inch thick

4 0.00010 inch thick


specifications

ASTM B 734 Standard Specification for Electrodeposited Copper for Engineering Uses


thickness classes:


25 25μ" minimum

20 20μ" minimum

12 12μ" minimum

5 5μ" minimum

x Thickness specified


specifications

AMS 2418 Plating, Copper


type i


Engineering


type ii


For Masking


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